PCBA加工常涉及一些英語術語，格亞信PCBA加工介紹一些常用的PCBA術語 ，便于更詳細了解PCBA加工詳細事項，由于相關術語較多，如需查閱相關術語，請在鍵盤上按 Ctrl + F 查詢。

板面凹痕
dent

內層白斑
I/L white spot

線路缺口
circuit nick

蝕刻不凈
under etching

綠油剝離
S/M peel off

顯影不凈
under developing

基材白點
laminate measling

銅面氧化
copper oxide

綠油上焊盤
s/m on pad

白字上焊盤
c/m on pad

阻焊不良
poor S/M

線路擦花
track scratch

錫上線
sn on circuit

聚錫
sn mass

錫灰
sn gray

焊盤露銅
cu exposed on pad

錫上金手指
sn on G/F

金手指凹痕
G/F dent

金手指擦花
G/F scratch

金手指粗糙
G/F roughness

v-cut 不良
poor V-cut

倒邊不良
poor milling

針床壓傷
ET dent

拖錫不良
poor touch up

補金不良
poor repairing Au

補油不良
poor repairing s/m

針孔
pinhole

膠漬
paster stain

孔內毛刺
burrs in hole

錫珠入孔
solder in hole

露銅
expose Cu

露鎳
expose Ni

綠油起泡
solder mask blister

綠油起皺
solder mask wrinkles

金手指氧化
G/F oxiding

金顏色不良
Au discoloration

金面凸起
Au surface blister

綠油入孔
solder mask in hole

爆板
board angle damage

翹板
warp

漏印字符
skip

金粗
Au too big

金簿
Au too thin

金手指缺口
G/F voids/nick on G/F

金手指發黑
G/F too black

字符印反
inverse C/M

金手指針孔
G/F pinholes

標志不清
symbol unclear

標志錯
symbol wrong

綠油鬼影
ghost in S/M

手指印
finger print

補線不良
poor line repairing

錫高
excessive solder

孔小
hole undersize

字符錯
wrong C/M

字符印偏
C/M misalignment

字符入孔
C/M in hole

字符重影
C/M double image

漏鍍金手指
missing plating G/F

金手指發白
G/F gray

焊盤脫落
pad break off/pad peel off

焊盤露銅
pad expose cu

斷綠油橋
missing S/M bridge

塞孔
block hole

水跡
water print

錫珠
solder ball

砂孔
pitting

聚油
excess solder mask

錫粗
Sn too thick

線路上錫
Sn overlap scratch

綠油下雜物
contamination under S/M (Foreign material under S/M)

焊盤損壞
(Pad)land damage

焊盤翹起
lifted (Pad)land

偏位
misregistration

漏鉆孔
missing hole

焊盤缺口
nick on pad

線路缺口
nick on track

開路
open circuit

短路
short circuit

線路狗牙
circuit wist

線路缺口
circuit nick

線路凹痕
circuit dent

滲鍍
plating bleeding

焊盤缺口
pad nick

內層白斑
I/L white spot

黑化不良
poor B.O

爆板
delamination

粉紅圈
pinking ring

層壓起泡
press blister

錯位
misregistation

偏位
shift

孔內無銅
no Cu on PTH (PTH Void)

孔內毛刺
hole burrs

NPTH 有銅
Cu on NPTH

銅面露基材
exposed laminate

銅面凹痕
dent on Cu surface

膠漬
gum stain

夾膜
D/F nip

蝕刻不盡
under etching

線幼
line too thin

孔大
hole oversize

孔小
hole undersize

偏孔
hole misregistration

銅面瘤粒
Cu nodule

顯影不盡
under developing

銅面刮傷
scratch on Cu surface

塞孔
hole plugged

修理不良
poor repairing

銅薄
copper too thin

內層擦花
I/L scratch

內層偏位
I/L misregistation

內層雜物
I/L inclusions

掉膜
D/F peel off

干膜碎
D/F residual

退錫不盡
poor Sn stripping

間隙小
space too narrow

板薄
board too thin

板厚
board too thickness

針孔
pinhole

崩孔
breakout

側蝕
undercut

鍍層粗糙
plating layer roughness

亞色
dull colour

焊盤翹起
lifted (Pad)land

漏鉆孔
missing hole

露布紋
weave exposure

鉆偏孔
hole misregistratiion

孔損害
hole damage

基材分層
delamination

蝕刻過度
over etching

多孔
hole too many

殘銅
remain Cu

孔內露基材
laminate exposure in hole

焊盤脫落
pad break off (peel off)

焊盤凹痕
pad dent

焊盤凸起
pad bulge

焊盤損壞
pad damaged

焊盤缺口
pad nick

焊盤露銅
pad expose Cu

內層開路
Inner open

內層短路
Inner short

外層開路
Outer open

外層短路
Outer short

內(nei)層蝕(shi)刻(ke)過度 Inner over etching

外層蝕刻過度(du) Outer over etching

內(nei)層(ceng)樹脂(zhi)氣泡(pao) Resin void

內層雜物
Foreign material

內層圖形移(yi)位 Inner pattern mis-registration

層與層移位
Layer to layer mis-registration

打孔不良
Improper targeting

內層蝕刻不(bu)凈 Inner under etching

露布紋
Weave texture/exposure

擦花（氧化膜面）
Scratch(Oxide surface)

板損壞
Damaged board

分層（物料）
Delamination (Raw material)

內層不配套
Excessive inner core
(mismatch inner layer cores)

板過厚
Over thickness

白點（壓板）
Measling (Pressing)

白點（噴錫）
Measling (HASL)

板曲
Warpage

板焦黃
Burnt

起皺
Wrinkle

起泡（壓板）
Blistering (Pressing)

鍍層起泡
Blistering (Cu plating)

噴錫起泡
Blistering (HASL)

板面凹痕
DENT (Pressing profiling G/F)

白斑
Crazing

膠渣
Gum residue

孔未穿
Incomplete drilling

披鋒
Burr

多孔
Extra hole

偏孔
Hole shift

孔徑大
Hole oversize

孔徑小
Hole undersize

少孔
Missing Hole

塞孔
Block hole

崩孔
Hole breakout

孔粗糙(鍍銅）
Hole roughness（Cu plating)

孔粗糙機械鉆孔）
Hole roughness(Mechanical drill)

崩線、線路缺口 Nick
/
void on trace

缺口
Nick
/
void on pad

曝光過度
Over-exposure

曝光不良
Under exposure

顯影不足
Under develop

干膜脫落
D/F Peel off

干膜碎
D/F Residue/Residual

干膜移位
D/F Mis-registration

標志不清（曝光）
Illegible marking (exposure)

錯菲林
Wrong A/W

非鍍銅孔有銅 Copper in NPTH

鍍銅孔(kong)內無銅 No copper in PTH

滲鍍
Nickel smear

電鍍粗糙
Rough plating

孔壁缺口
Hole void (Cu)

金手指顏(yan)色不(bu)良 Gold Finger discoloration

金(jin)面顏(yan)色(se)不良(liang) Gold discoloration

金面陰陽色
Two tone colour on gold surface

銅、鎳脫落
Copper/Nickel peel off

銅鍍厚度超(chao)要(yao)求 Copper thickness out of requirement

漏鍍（金手指等）
Skip plating(G/F ENIG Cu)

金面污點
Stain on gold surface

電鍍針孔
Plating pits (Cu) (Plating Pinholes)

鍍錫缺點
Tin plating defect

銅碎
Copper residue

黑孔
Black Hole

鍍層白漬
Plating haze

金手指凸出
Protrusion (G/F)

板污
Board contamination

手指套印
Glove mark

褪錫不良
Improper Tin stripping

微短路
Micro short

粉紅圈
Pink ring

焊盤崩缺
Broken annular ring
（Broken Pad）

蝕刻不凈
Under etching

焊盤脫落
Pad peel off

綠油上焊盤
S/M on pad

綠油圖形移位
Pattern mis-registration

綠油露線
Expose trace

油薄
Uneven S/M thickness

入孔
S/M in hole

綠油沖板不良
S/M under develop

漏塞孔
S/M unplugged

IC 欄不良
Poor IC barrier

綠油脫落
S/M peel off

塞孔不滿
Incomplete S/M plugging

多開綠油窗
Extra opening

溶劑測試失敗
Fail in solvent test

漏印
Skip printing

水印
Water mark (stain)

斷綠油橋
S/M Bridge broken

綠油下氧化
Oxidation under solder mask

返工不良
Poor rework

錯油
Wrong Ink

漏印字符
Missing legend ink

字符入孔
Legend in Hole

字符脫落
Legend peel off

字符上焊盤
Legend on pad

字符不清
Illegible legend

日期不清
Illegible date code

鑼坑次品
Milling (Routing) Defects

啤板方向錯
Wrong punch direction

漏鑼
Missing routing

漏斜切
Missing chamfering

斜邊過度
Over chamfefing

錯外形尺寸
Wrong outline dimension

倒邊不良
Bevelling defect

金手指脫落
Gold finger peel off

露鎳、銅
Ni/Cu exposure

缺口
Nick (G/F)

涂層不良
Poor ENTEK

錫上金手指
Solder on G/F

上錫不良
Dewetting

不上錫
Non wetting

錫珠、錫堆
Solder ball/lump

錫上線
Solder on trace

針痕
Pin mark

阻抗超出要求
Impedance out of requirement

工程試驗
Engineering Evaluation

微切片
Microsection